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Product Name: |
Wafer laser scribing machine UV
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Supply Ability: |
2000pieces |
Related proudcts |
high speed, laser scribing, high realiability, |
Specifications |
TH-5210 |
Price Term: |
FOB |
Port of loading: |
Shanghai |
Minimum Order |
1 |
Unit Price: |
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Features 1.High speed scribing, high efficiency and low defective rate. 2.Non-touch processing without mechanical stress, thus improving wafer quality. 3.CCD high speed positioning, real-time coaxial or paraxial monitoring system 4.High accuracy 2D linear feeding platform and high accuracy DD rotation platform 5.Marble base with high stability and low thermal deformation 6.CNC control 7.Friendly interface and easy to operate 8.Scribing technology expert system. 9.High reliability and stability 10.Laser source:IR/UV(optional) Application Widely used for scribing og IC wafer¡¢GPP diode wafer, GPP-silicon controlled wafer. Technical Parameter Laser type: Ultraviolet(UV) Model: TH-5210 Wavelength: 355nm Power: 5W/10W/17W Max. Wafer dimension: 6 inch Scribing speed: 30mm/s Line width: 20-30um Line depth: 50-100um Positioning accuracy: 5um Repeating: 2um Service life: 100000hours
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Company: |
Suzhou Tianhong Laser Co., Ltd
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Contact: |
Ms. Yulin Li |
Address: |
No.66 Tonghe Road, Weiting, Industrial Park Zone |
Postcode: |
215122 |
Tel: |
86 62991330 |
Fax: |
86 051262745987 |
E-mail: |
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