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Build Your Online Product Catalogs?
| Product Name: |
Wafer laser cutting machine
|
| Supply Ability: |
2000pieces |
| Related proudcts |
high efficiency, laser cutting, high speed, |
| Specifications |
TH-4212 |
| Price Term: |
FOB |
| Port of loading: |
Shanghai |
| Minimum Order |
1 |
| Unit Price: |
|
|
Features:
1.Simplify production process to reduce manufacturing cost.
2.High speed, high efficiency and low defective rate.
3.Non-touch processing without mechanical stress, thus ensuring
4.Water high quality.
5.CCD high speed positioning.
6.High accuracy 2D linear feeding platform and high accuracy DD rotation platform.
7.Marble base with high stability and low thermal deformation CNC control.
8.Friendly interface and easy to operate.
9.Scribing technology expert system.
10.High reliability and stability.
11.Laser sources: IR/UV(optional)
Application
Widely used for scribing og IC wafer¡¢GPP diode wafer, GPP-silicon controlled wafer.
Techinical Parameter
Laser type: Infrared(IR)
Model: TH-4212
Wavelength: 1064nm
Power: 20W/30W
Max. Wafer dimension: 4 inch
Scribing speed: 150mm/s
Line width: 40-55um
Line depth: 50-120um
Positioning accuracy: 5um
Repeating: 2um
Service life: 100000hours |
| Company: |
Suzhou Tianhong Laser Co., Ltd
|
| Contact: |
Ms. Yulin Li |
| Address: |
No.66 Tonghe Road, Weiting, Industrial Park Zone |
| Postcode: |
215122 |
| Tel: |
86 62991330 |
| Fax: |
86 051262745987 |
| E-mail: |
|
|
|
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