Suzhou Tianhong Laser Co., Ltd

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ito laser etching machine/system
Specification: TH
Detail: Features: 1.High accuracy and high speed, stable performance, suitable for mass production. 2.Support DXF files. 3.Save labor cost and cost consumption. 4.Low defective rate. Stability. 5.CCD automatic positioning. Easy a...

wafer laser cutting machine uv
Specification: TH-4210
Detail: Features: 1.Simplify production process to reduce manufacturing cost. 2.High speed, high efficiency and low defective rate. 3.Non-touch processing without mechanical stress, thus ensuring 4.Water high quality. 5.CCD high...

wafer laser cutting machine
Specification: TH-4212
Detail: Features: 1.Simplify production process to reduce manufacturing cost. 2.High speed, high efficiency and low defective rate. 3.Non-touch processing without mechanical stress, thus ensuring 4.Water high quality. 5.CCD high...

wafer laser scribing machine uv
Specification: TH-5210
Detail: Features 1.High speed scribing, high efficiency and low defective rate. 2.Non-touch processing without mechanical stress, thus improving wafer quality. 3.CCD high speed positioning, real-time coaxial or paraxial monitoring ...

wafer laser scribing machine
Specification: TH-5221
Detail: Features 1.High speed scribing, high efficiency and low defective rate. 2.Non-touch processing without mechanical stress, thus improving wafer quality. 3.CCD high speed positioning, real-time coaxial or paraxial monitoring ...

wafer laser perforating machine
Specification: TH
Detail: Features 1.Equipped with IPG laser, with steady power, long service life and free maintenance. 2.Stable light path. With good hole punching uniformity and verticality. 3.Synchronous feeding and drilling with high speed. 4....

film cutting
Specification: TH
Detail: Features 1.High precision 2.High efficiency 3.CCD alignment 4.Red beam guiding 5.Auxiliary with air blow 6.Easy to operate 7.Suitable for all kinds of high polymer material cutting 8.Long service life. Application It...

laser drilling machine
Specification: TH-LDR
Detail: Introduction Laser drilling machine boasts high energy, high density andnon-contact processing. It can drill with precision an both metallic and non-metallicparts. It boasts inco***rable advantage of drilling on plastics. Fe...

laser marker especially for bearing
Specification: TH
Detail: Introduction 1.Lntegrate double air cylinder and plane transmission position system, 2.Specially designed for the mass production of bearings mark. 3.It marks on the end side of bearings with different specifications 4.It ...

hi-speed plane and cylinder laser marker
Specification: TH
Detail: Introduction: 1.Suitable for continuous marking of characters and logos on large angle work piece. 2.It can mark the character and logo 360 rotary. 3.Symmetrically marking, no distortion of projection. 4.Min. Resolving cap...


Showing 51 - 60 of 96, total 10 pages [First] [Previous] [Next] [Last]
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